Potting of electronic and electrical components
Dispensing technology for polyurethane, epoxy and silicone
Electrical and electronic components are used in a large number of products and their reliability has become a matter of course for the end customer – even under extreme ambient conditions. Such conditions may range from impacts and vibrations to dust or moisture or even high temperatures. To ensure reliable operation and correct electrical insulation, the components are potted with liquid compounds. Potting forms a permanent joint with the component and thus protects it against unauthorised intervention. Depending on the potting compound and the specific application, the process is carried out under atmospheric pressure or vacuum. One of the processing challenges faced is to achieve bubble-free potting because entrapped air will lower the insulation and protection capability as well as the mechanical strength of the components.
DOPAG mixing and metering systems enable repeatable high-precision metering. Such metering involves a constant mixing ratio even at varying flow rates in dynamical processes. As seen both from the ecological and economical perspectives, DOPAG metering and mixing systems promote a sustainable production process. The materials to be processed are mixed based on the specific demand which means material consumption and waste disposal costs can be reduced. The use of flushing agents is not required.
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Protection against shock, vibration, dust, humidity or high temperatures
Most of the potting compounds used in electronics are polymers based on polyurethane (PU), epoxy resin and silicone. Thanks to their high thermal stability and the fact that they can be from soft to extremely hard, e.g. PU cast resins are used for numerous applications such as potting of printed circuit transformers in PCBs. Today, PU cast resins that belong to the class F of the insulation system and show a high thermal stability are increasingly being used for potting electronic components while elastic PU cast resins are being used for automobile electronic systems.
We offer solutions for
- Potting of electrical components
- Potting of windings of electric motors and transformers
- Potting of LEDs in transparent plastic
- Potting of electronic components on printed circuit boards
- Potting of semiconductors
Individual dispensing systems for automated potting
Casos de aplicación
Bonding and sealing is becoming an increasingly popular method of joining components without screws. With DOPAG systems, applications can be realized reliable and precise.
In Potting, resins such as silicones, polyurethanes or epoxy resins are used in liquid form. For the production process, DOPAG offers various metering and mixing systems.
With dynamicLine and the new dynamic mixing head, DOPAG offers an efficient solution for all applications relating to gasketing.